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Patent Searching and Data


Title:
LAMINATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/020064
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a metallic material which can be applied to a constituent member for a semiconductor production device and has excellent corrosion resistance, particularly corrosion resistance to acids and high-temperature steam. A laminate according to the present invention comprises a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, wherein pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or more.

Inventors:
FURUYA AKIRA (JP)
KOJIMA TADAAKI (JP)
SUZUKI HIROSHI (JP)
NAKA FUMIAKI (JP)
Application Number:
PCT/JP2020/026840
Publication Date:
February 04, 2021
Filing Date:
July 09, 2020
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
C23C28/00; B32B15/01; C23C18/18; C23C18/31; C23C18/52
Foreign References:
JP2009057596A2009-03-19
JP2017021956A2017-01-26
JP2000015743A2000-01-18
JP2003293147A2003-10-15
JP2001234360A2001-08-31
JP2954716B21999-09-27
JP3094000B22000-10-03
JP2004360066A2004-12-24
JP2008260646A2008-10-30
Other References:
See also references of EP 4006201A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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