Title:
LAMINATE, MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING THESE
Document Type and Number:
WIPO Patent Application WO/2021/090900
Kind Code:
A1
Abstract:
A metal coating layer is formed by sputtering on the surface of an etched substrate on which holes have been formed, and on the surface of a sealing member. The metal coating layer of the substrate and the metal coating layer of the sealing member are laminated so as to be in contact with each other, and the metal atoms of both metal coating layers are diffused to join the substrate and the sealing member.
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Inventors:
NAKADA RYOICHI
Application Number:
PCT/JP2020/041431
Publication Date:
May 14, 2021
Filing Date:
November 05, 2020
Export Citation:
Assignee:
ENPLAS CORP (JP)
International Classes:
B23K20/00; B01J19/00; B23K26/53; B32B37/00; B81B1/00; B81C3/00; C03C15/00; C03C27/08
Domestic Patent References:
| WO2019138875A1 | 2019-07-18 | |||
| WO2013002339A1 | 2013-01-03 |
Foreign References:
| JP2007289818A | 2007-11-08 | |||
| JP2018157159A | 2018-10-04 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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