Title:
LAMINATE, ORGANIC SEMICONDUCTOR DEVICE, METHODS FOR MANUFACTURING LAMINATE AND ORGANIC SEMICONDUCTOR DEVICE, COMPOSITION, AND COMPOSITION KIT
Document Type and Number:
WIPO Patent Application WO/2020/111007
Kind Code:
A1
Abstract:
A laminate having, in the sequence listed, a substrate, an organic layer, an electroconductive layer, a protective layer for protecting the surface of the electroconductive layer, and a photosensitive layer. The electroconductive layer is in contact with the organic layer and subjected to wet etching. The photosensitive layer includes a material in which the dissolution rate of the photosensitive layer in a developer solution changes due to the action of light and/or radiation. The present invention also pertains to a method for manufacturing the laminate. The present invention also pertains to an organic semiconductor device having the laminate, and a method for manufacturing the organic semiconductor device. The present invention also pertains to a composition used to form the laminate, and a kit including the composition.
Inventors:
GOTO TAKASHI (BE)
NAKAMURA ATSUSHI (BE)
KE TUNG HUEI (BE)
ROLIN CEDRIC (BE)
NAKAMURA ATSUSHI (BE)
KE TUNG HUEI (BE)
ROLIN CEDRIC (BE)
Application Number:
PCT/JP2019/046010
Publication Date:
June 04, 2020
Filing Date:
November 25, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
IMEC VZW (BE)
IMEC VZW (BE)
International Classes:
H01L51/42; H01L21/28; H01L21/283; H01L21/336; H01L29/786; H01L51/50; H05B33/10; H05B33/26
Foreign References:
| JP2010251574A | 2010-11-04 | |||
| JP2006261408A | 2006-09-28 | |||
| JP2011254091A | 2011-12-15 | |||
| JP2014209593A | 2014-11-06 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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