Title:
LAMINATE, PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/120636
Kind Code:
A1
Abstract:
This laminate (1) comprises a first film (11) having a first thermal shrinkage rate, a second film (12) having a second thermal shrinkage rate lower than the first thermal shrinkage rate, and an air hole (14) through which air is allowed to flow in between the first film (11) and the second film (12) at a non-bonded part (16). In a situation where the air hole (14) is formed in a bonded part (15) where the first film (11) and the second film (12) are bonded together, the non-bonded part (16) is surrounded by the bonded part except the place where the air hole (14) is formed.
Inventors:
ODAGIRI SHUN (JP)
INAGAWA YOSHINORI (JP)
SAKURAI RIKI (JP)
TAKAGI KAZUYA (JP)
INAGAWA YOSHINORI (JP)
SAKURAI RIKI (JP)
TAKAGI KAZUYA (JP)
Application Number:
PCT/JP2022/047328
Publication Date:
June 29, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
FUJI SEAL INT INC (JP)
International Classes:
B65D65/40; B29C61/02
Domestic Patent References:
| WO2014115558A1 | 2014-07-31 |
Foreign References:
| JP2018154393A | 2018-10-04 | |||
| JP2013224164A | 2013-10-31 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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