LAMINATE PEELING METHOD, LAMINATE, AND LAMINATE PRODUCTION METHOD

Title:

LAMINATE PEELING METHOD, LAMINATE, AND LAMINATE PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2020/100965

Kind Code:

A1

Abstract:

The present invention comprises a first step and a second step. In the first step, when bonding a first substrate 11 made from a semiconductor-forming substrate and a second substrate 12 made from a support substrate that allows the passage of an infrared laser light, with a first adhesive layer 13 provided to the first substrate side and a second adhesive layer 14 provided to the second substrate 12 side, to constitute a laminate 10, the first adhesive layer 13 is made to serve as an adhesive layer by curing the adhesive (A) containing a component that is cured by a hydrosilylation reaction, and the second adhesive layer 14 is made to serve as an adhesive layer which allows the passage of infrared light, obtained using an adhesive (B) which is a polymer adhesive having an aromatic ring on at least one of the main chain or a side chain. In the second step, the laminate is irradiated with infrared laser light from the second substrate side, peeling between the first adhesive layer and the second adhesive layer.

Inventors:

SAWADA KAZUHIRO (JP)
MORIYA SHUNSUKE (JP)
SHINJO TETSUYA (JP)

Application Number:

PCT/JP2019/044641

Publication Date:

May 22, 2020

Filing Date:

November 14, 2019

Export Citation:

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Assignee:

NISSAN CHEMICAL CORP (JP)

International Classes:

H01L21/02; B32B27/00; C09J5/00; C09J5/04; C09J5/06; C09J183/04; H01L21/304

Domestic Patent References:

WO2015190438A1

2015-12-17

Foreign References:

JP2016086158A	2016-05-19
JP2015191940A	2015-11-02
JP2012510715A	2012-05-10
JP2012513684A	2012-06-14
JP2013179135A	2013-09-09
JP2013232459A	2013-11-14
JP2006508540A	2006-03-09
JP2009528688A	2009-08-06
JPH06329917A	1994-11-29

Other References: