Title:
LAMINATE PLATE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING LAMINATE PLATE
Document Type and Number:
WIPO Patent Application WO/2023/033116
Kind Code:
A1
Abstract:
This laminate plate (2) has: an insulating layer (20); a first metal layer (21) provided on one surface of the insulating layer (20); and a second metal layer (22) provided on the other surface of the insulating layer (20), the laminate plate having a rectangular shape when viewed from the top, wherein the surface side of the first metal layer (21) and the surface side of the second metal layer (22) are concavely bent, and the concavely bent amount (δ1) is 0.1-1.0 mm inclusive.
Inventors:
KAGAWA MIKA (JP)
Application Number:
PCT/JP2022/033002
Publication Date:
March 09, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B15/04; B30B7/00; B32B7/025; H05K1/03
Foreign References:
| JP2003273289A | 2003-09-26 | |||
| JP2013069767A | 2013-04-18 | |||
| JPH11330308A | 1999-11-30 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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