Title:
LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2010/024175
Kind Code:
A1
Abstract:
Disclosed are: a laminate in which the adhered part between a conductor layer and an insulating resin layer has good smoothness and high adhesive strength; a process for producing the laminate; and an electronic circuit board. Specifically disclosed are: a laminate which comprises a resin layer and a metal layer, wherein the resin layer comprises a resin film containing a thermoplastic cyclic olefin resin, wherein the at least a part of the surface of the resin film is modified by ionizing radiation irradiation, and wherein the metal layer is formed by plating on the modified part of the surface of the resin film; a process for producing the laminate; and an electronic circuit board which has a circuit formed by etching the metal layer in the laminate by photolithography.
Inventors:
WATANABE MITSUHIRO (JP)
HONMA HIDEO (JP)
TADA MITSUSHI (JP)
IGA TAKASHI (JP)
TANAHASHI NAOKI (JP)
HONMA HIDEO (JP)
TADA MITSUSHI (JP)
IGA TAKASHI (JP)
TANAHASHI NAOKI (JP)
Application Number:
PCT/JP2009/064562
Publication Date:
March 04, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
KANTO GAKUIN UNIVERSITY SURFAC (JP)
KANTO KASEI KOGYO (JP)
ZEON CORP (JP)
WATANABE MITSUHIRO (JP)
HONMA HIDEO (JP)
TADA MITSUSHI (JP)
IGA TAKASHI (JP)
TANAHASHI NAOKI (JP)
KANTO KASEI KOGYO (JP)
ZEON CORP (JP)
WATANABE MITSUHIRO (JP)
HONMA HIDEO (JP)
TADA MITSUSHI (JP)
IGA TAKASHI (JP)
TANAHASHI NAOKI (JP)
International Classes:
B32B15/08; B32B15/085; H05K1/03; H05K3/18
Foreign References:
| JP2005047991A | 2005-02-24 | |||
| JP2005047992A | 2005-02-24 | |||
| JP2006108165A | 2006-04-20 |
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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