Title:
LAMINATE PRODUCTION PROCESS
Document Type and Number:
WIPO Patent Application WO/2012/046615
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a laminate production process which enables the production of a laminate that has a patterned copper-containing plating film that does not undergo the formation of metal residues during an etching treatment and has excellent linearity and adhesion properties. This process for producing a laminate having a patterned copper-containing plating film comprises: a polymer layer formation step of forming a polymer layer on a substrate; a catalyst application step of bringing the polymer layer into contact with a plating catalyst solution that contains copper ions and having a pH value of higher than 3.0 to apply the copper ions to the polymer layer; a first aqueous alkaline solution contact step of bringing the copper-ion-applied polymer layer into contact with an aqueous alkaline solution; a plating step of, subsequent to the first aqueous alkaline solution contact step, subjecting the polymer layer to at least a copper plating treatment to produce a copper-containing plating film; and a pattern formation step of, subsequent to the plating step, etching the copper-containing plating film into a patterned form to form the patterned copper-containing plating film.
Inventors:
TATEISHI TOMOMI (JP)
KUBOTA YUTAKA (JP)
KUBOTA YUTAKA (JP)
Application Number:
PCT/JP2011/072347
Publication Date:
April 12, 2012
Filing Date:
September 29, 2011
Export Citation:
Assignee:
FUJIFILM CORP (JP)
TATEISHI TOMOMI (JP)
KUBOTA YUTAKA (JP)
TATEISHI TOMOMI (JP)
KUBOTA YUTAKA (JP)
International Classes:
C23C18/18; B32B15/08; H05K3/06; H05K3/18; H05K3/38
Foreign References:
| JP2009010336A | 2009-01-15 | |||
| JP2004238731A | 2004-08-26 | |||
| JP2008214706A | 2008-09-18 | |||
| JPS6115983A | 1986-01-24 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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Claims: