Title:
LAMINATE SHEET FOR METAL CLAD LAMINATE BOARD AND PRODUCTION METHOD THEREFOR, AND METAL CLAD LAMINATE BOARD AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/200611
Kind Code:
A1
Abstract:
The problem addressed by the present invention is providing a laminate sheet for a metal clad laminate board, which comprises an adhesive layer and a substrate containing a liquid crystal polymer or a fluorine polymer and which exhibits excellent adhesion to a metal layer formed on the aforementioned adhesive layer, and a production method therefor. In addition, the other problem addressed by the present invention is providing a metal clad laminate board and a production method therefor. The laminate sheet for a metal clad laminate board of the present invention is obtained by laminating, in order: a substrate containing a liquid crystal polymer or a fluorine polymer; an inorganic oxide layer; and an adhesive layer.
Inventors:
ICHIKI TAKAHIKO (JP)
MOCHIZUKI YOSHIHIKO (JP)
MOCHIZUKI YOSHIHIKO (JP)
Application Number:
PCT/JP2021/012762
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B9/00; B32B15/08; B32B27/00; B32B27/30; C08L67/03; C09J7/35; H05K1/03
Domestic Patent References:
| WO2016143688A1 | 2016-09-15 | |||
| WO2018163999A1 | 2018-09-13 | |||
| WO2009104443A1 | 2009-08-27 |
Foreign References:
| JP2011143718A | 2011-07-28 | |||
| JP2018160636A | 2018-10-11 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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