Title:
LAMINATE STRUCTURE, STAGE, SEMICONDUCTOR MANUFACTURING DEVICE, AND MANUFACTURING METHOD FOR LAMINATE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/120112
Kind Code:
A1
Abstract:
This laminate structure is for a semiconductor manufacturing device, the laminate structure including: a base body containing aluminum and having a first surface; an intermediate layer disposed on the first surface of the base body and containing aluminum oxide; and a cover layer disposed on the intermediate layer and containing metal atoms. The intermediate layer has a partition wall which forms a plurality of voids in a cross-sectional shape parallel to the first surface. The intermediate layer has a boundary layer covering the first surface of the base body. The cover layer is disposed on a portion of the plurality of voids in the intermediate layer. The plurality of voids include voids adjacent to the boundary layer and separated from the cover layer.
Inventors:
OTSUKA YUSUKE (JP)
KIDA NAOYA (JP)
FUTAKUCHIYA JUN (JP)
KANEDA NORIYOSHI (JP)
YOKOYAMA HIBIKI (JP)
SONE MICHIYOSHI (JP)
SAKAMOTO HIROKI (JP)
KIDA NAOYA (JP)
FUTAKUCHIYA JUN (JP)
KANEDA NORIYOSHI (JP)
YOKOYAMA HIBIKI (JP)
SONE MICHIYOSHI (JP)
SAKAMOTO HIROKI (JP)
Application Number:
PCT/JP2022/044537
Publication Date:
June 29, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
H01L21/683; B32B9/04; B32B15/04; B32B15/20; C23C14/50; H01L21/205; H01L21/31
Foreign References:
| JP2006241589A | 2006-09-14 | |||
| JP2017115193A | 2017-06-29 | |||
| JPH05210245A | 1993-08-20 | |||
| JP2007227443A | 2007-09-06 |
Attorney, Agent or Firm:
TAKAHASHI, HAYASHI AND PARTNER PATENT ATTORNEYS, INC. (JP)
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