Title:
LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/070775
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a laminate which has excellent low-k dielectric properties, low water absorption, and adhesion. A laminate according to the present invention has a copper layer and a polymer layer, wherein the polymer layer contains a polyarylate, and the polyarylate has: at least one repeating unit I selected from the group consisting of a repeating unit represented by formula (I-A), a repeating unit represented by formula (I-B), and a repeating unit represented by formula (I-C); and a repeating unit II represented by formula (II).
Inventors:
HIRONAKA KOJI (JP)
INOMATA SOTARO (JP)
INOMATA SOTARO (JP)
Application Number:
PCT/JP2023/033752
Publication Date:
April 04, 2024
Filing Date:
September 15, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B15/09; C08G63/185; C08G63/193; H05K1/03
Foreign References:
| JP2017214557A | 2017-12-07 | |||
| JP2014189605A | 2014-10-06 | |||
| JP2003313491A | 2003-11-06 | |||
| JP2018066018A | 2018-04-26 | |||
| JP2001148551A | 2001-05-29 | |||
| JP2015187214A | 2015-10-29 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF: