Title:
LAMINATED BOARD AND PROBE CARD
Document Type and Number:
WIPO Patent Application WO/2005/114228
Kind Code:
A1
Abstract:
In a laminated board and a probe card, thermal deformation is remarkably suppressed without using a special material. The probe card is provided with at least one circuit board electrically conductively connected with a probe which is brought into electrically contact with an object to be inspected. The circuit board is provided with a base material layer, and a surface layer laminated at least on a base material layer surface on the side of the object to be inspected. The surface layer has a higher thermal expansion coefficient than that of the base material layer, and a groove is provided on the surface layer to divide the surface layer into a plurality of parts.
Inventors:
MOCHIZUKI JUN (JP)
HOSAKA HISATOMI (JP)
HOSAKA HISATOMI (JP)
Application Number:
PCT/JP2005/009439
Publication Date:
December 01, 2005
Filing Date:
May 24, 2005
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
MOCHIZUKI JUN (JP)
HOSAKA HISATOMI (JP)
MOCHIZUKI JUN (JP)
HOSAKA HISATOMI (JP)
International Classes:
G01R31/26; G01R1/073; H01L21/66; H05K1/02; G01R1/04; H05K1/03; (IPC1-7): G01R1/073; G01R31/26; H01L21/66
Foreign References:
| JPH0763787A | 1995-03-10 | |||
| JP2003279594A | 2003-10-02 | |||
| JP2003207523A | 2003-07-25 | |||
| JP2000306961A | 2000-11-02 | |||
| JP2002141379A | 2002-05-17 | |||
| JP2001056346A | 2001-02-27 |
Attorney, Agent or Firm:
Kanemoto, Tetsuo (Shinjuku Akebonobashi Building 1-12,
Sumiyoshi-cho, Shinjuku-k, Tokyo 65, JP)
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