LAMINATED BODY, MANUFACTURING METHOD THEREOF, AND LAMINATED CIRCUIT BOARD

Title:

LAMINATED BODY, MANUFACTURING METHOD THEREOF, AND LAMINATED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2010/071145

Kind Code:

A1

Abstract:

Provided is a laminated body used for device production which can be positioned precisely, can be removed smoothly once produced, and does not come off during the production process. The laminated body is produced by laminating a glass plate, an organic layer such as a silicon wafer, and a film having a polyamide linear expansion coefficient within a prescribed range which is obtained through reaction between an aromatic tetracarboxylic acid and an aromatic diamine without using a bonding layer. The 180° peel strength between the film and the organic layer of the laminated body is within a prescribed range.

Inventors:

OKUYAMA TETSUO (JP)
WAKUI HIROYUKI (JP)
YOSHIDA TAKEHUMI (JP)
TSUSTUMI MASAYUKI (JP)
OKAMOTO JUN (JP)
TSUTIYA TOSHIYUKI (JP)
MAEDA SATOSHI (JP)

Application Number:

PCT/JP2009/070961

Publication Date:

June 24, 2010

Filing Date:

December 16, 2009

Export Citation:

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Assignee:

TOYO BOSEKI (JP)
OKUYAMA TETSUO (JP)
WAKUI HIROYUKI (JP)
YOSHIDA TAKEHUMI (JP)
TSUSTUMI MASAYUKI (JP)
OKAMOTO JUN (JP)
TSUTIYA TOSHIYUKI (JP)
MAEDA SATOSHI (JP)

International Classes:

B32B17/10; B32B7/06; B32B15/088; B32B18/00

Foreign References:

JP2003101193A	2003-04-04
JP2007076231A	2007-03-29
JP2008227209A	2008-09-25
JP2002170431A	2002-06-14
JPH0656992A	1994-03-01
JPH11504369A	1999-04-20
JPH11505184A	1999-05-18

Other References: