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Title:
LAMINATED BODY AND METAL-CLAD LAMINATE HAVING LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2023/145135
Kind Code:
A1
Abstract:
Provided is a metal-clad laminate (for example, copper-clad laminate (CCL) in which curling is suppressed and which excels in adhesiveness (adhesion) between a base material film (laminated body) and a metal film and dimensional stability while having good electrical properties (dielectric properties) compatible with 5G.　Also provided is a laminated body for a printed wiring board, which is used to form the metal-clad laminate.　This laminated body comprises: a low-CTE resin film having a coefficient of linear thermal expansion (CTE) of 50 ppm/°C or less; and a high-CTE resin film having a coefficient of linear thermal expansion (CTE) of greater than 50 ppm/°C and laminated on both sides of the low-CTE resin film, wherein the low-CTE resin film does not have a melting point at 300°C or less, the low-CTE resin film does not melt at a temperature obtained by adding 30°C to the melting point of the high-CTE resin film, the high-CTE resin film has a melting point of 250°C or higher, and the high-CTE resin film has a tensile elongation at break in the machine direction (MD direction) of 400% or less.

Inventors:
YOSHIDA KAZUYOSHI (JP)
KOIZUMI AKIHIRO (JP)
Application Number:
PCT/JP2022/036096
Publication Date:
August 03, 2023
Filing Date:
September 28, 2022
Export Citation:
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Assignee:
SHIN ETSU POLYMER CO LTD (JP)
International Classes:
B32B7/027; B32B15/08; H05K1/03
Foreign References:
JP2005047214A2005-02-24
JP2011051203A2011-03-17
JP2020163841A2020-10-08
JP2022148546A2022-10-06
JP2022169444A2022-11-09
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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