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Title:
LAMINATED BODY, METHOD FOR MANUFACTURING LAMINATED BODY, METHOD FOR FORMING OPTICAL BODY, AND CAMERA MODULE MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/095792
Kind Code:
A1
Abstract:
Provided is a laminated body that makes it possible to easily peel off a thin film structural body having a fine irregularity structure on a surface thereof when adhering the same to an object serving as an adherend, wherein environment test durability is improved and occurrence of winding is reduced. The laminated body is provided with a thin film structural body and a retention film. The laminated body has a first retention film laminated on one surface of the thin film structural body and a second retention film laminated on the other surface thereof. The thin film structural body has a first fine irregularity structure on a surface thereof contacting the first retention film and a second fine irregularity structure on a surface thereof contacting the second retention film. The first retention film has a third fine irregularity structure on a surface thereof contacting the thin film structural body. The second retention film has a fourth fine irregularity structure on a surface thereof contacting the thin film structural body. The laminated body has a half-cut part. The second retention film has an UV curing resin, and the UV curing resin has a storage modulus of 1.1 GPa or less at 25°C.

Inventors:
SUGATA HIROSHI (JP)
TAZAWA HIROSHI (JP)
KAJIYA SHUNICHI (JP)
Application Number:
PCT/JP2019/042601
Publication Date:
May 14, 2020
Filing Date:
October 30, 2019
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B3/30; B32B7/022; B32B27/16; G02B1/118; G03B11/00
Domestic Patent References:
WO2014065136A12014-05-01
Foreign References:
JP2016122163A2016-07-07
JP2011221131A2011-11-04
JP2012242803A2012-12-10
JP2013134276A2013-07-08
JP2016210150A2016-12-15
JP2007009133A2007-01-18
JP2017149948A2017-08-31
JP2004151633A2004-05-27
Other References:
See also references of EP 3878643A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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