Title:
LAMINATED CORE MANUFACTURING METHOD, ADHESIVE APPLICATION DEVICE, AND LAMINATED CORE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/110358
Kind Code:
A1
Abstract:
Provided are a laminated core manufacturing method, adhesive application device, and laminated core manufacturing apparatus that make highly accurate adhesive application possible and have excellent productivity. Before or after the stamping out of a magnetic metal plate 1, 2 into a prescribed shape, an adhesive 3 is contactlessly applied to the magnetic metal plate 1, 2 through jet dispensing from the rear side in the stamping direction (step S2). After a plurality of the resulting magnetic metal plates are laminated, the magnetic metal plates are integrated through the subsequent hardening of the adhesive 3 (step S3). This results in the manufacturing of a laminated core in which a plurality of magnetic metal plates of a prescribed shape are laminated via an adhesive.
Inventors:
KAMIYAMA SEIYA (JP)
UENO TAKEHIKO (JP)
YONEYAMA WATARU (JP)
UENO TAKEHIKO (JP)
YONEYAMA WATARU (JP)
Application Number:
PCT/JP2019/025063
Publication Date:
June 04, 2020
Filing Date:
June 25, 2019
Export Citation:
Assignee:
CONNECT ALL CORP (JP)
SAN EI TECH LTD (JP)
SAN EI TECH LTD (JP)
International Classes:
H02K15/02; B05B12/10; B05B14/30; B05D1/26; B05D3/12; B05D7/14; B05D7/24; H01F41/02
Domestic Patent References:
| WO2008084843A1 | 2008-07-17 |
Foreign References:
| JP2001321850A | 2001-11-20 | |||
| JPH10100597A | 1998-04-21 | |||
| JPS4817833B1 | 1973-06-01 | |||
| JPH1157572A | 1999-03-02 | |||
| JPH11156266A | 1999-06-15 |
Attorney, Agent or Firm:
OMORI Keiko (JP)
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