Title:
LAMINATED FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/098203
Kind Code:
A1
Abstract:
Provided is a film capable of suppressing both the generation of wrinkles when a release film is suction-attached onto a cavity surface in compression molding, and the generation of wrinkles when a cavity bottom surface to which a release film has been suction-attached is raised. Also provided is a method for manufacturing a semiconductor element using said film.
A laminated film 1 includes: a layer 3 of a shrinkable film of which a storage elastic modulus E' at 180°C is at least equal to 70 MPa, and a thermal shrinkage at 180°C for 30 minutes, with reference to 20°C, in each of a machine direction (MD) and a transverse direction (TD) is at least equal to 3%; and a fluororesin layer 5 present on one or both surfaces of the shrinkable film 3.
Inventors:
KOTERA SEIGO (JP)
Application Number:
PCT/JP2018/042015
Publication Date:
May 23, 2019
Filing Date:
November 13, 2018
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B27/30; B29C33/68; B29C43/18; H01L21/56
Domestic Patent References:
| WO2015037426A1 | 2015-03-19 | |||
| WO2015133634A1 | 2015-09-11 | |||
| WO2015133630A1 | 2015-09-11 |
Attorney, Agent or Firm:
SENMYO Kenji et al. (JP)
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