Title:
LAMINATED INTERCONNECTS FOR ORGANIC OPTO-ELECTRONIC DEVICE MODULES
Document Type and Number:
WIPO Patent Application WO2006010911
Kind Code:
A3
Abstract:
A method of producing an encapsulated module of interconnected opto-electronic devices which comprises: forming a patterned anode layer (104); forming a layer of opto-electronically active material (108) over the patterned anode layer (104); forming a patterned cathode layer (110) over the layer of opto-electronically active material (108), to provide a device array (100) of opto-electronically active cells on the substrate; selectively removing portions of the layer of opto-electronically active material (108) so as to expose minor portions (104a) of the anodes (104); forming a patterned interconnect layer (171) on an encapsulating sheet (172) in a pattern to define an array of interconnect pads (171); and laminating the patterned encapsulating sheet (170) over the array (100) of opto-electronically active cells whereby the exposed anode portions (104a) are interconnected with the cathodes (110) of adjacent cells by the interconnect pads (171) and the interconnected cells are encapsulated by the encapsulating sheet (172).
Inventors:
HALLS JONATHAN (GB)
WILSON RICHARD (GB)
WILSON RICHARD (GB)
Application Number:
PCT/GB2005/002903
Publication Date:
September 21, 2006
Filing Date:
July 25, 2005
Export Citation:
Assignee:
CAMBRIDGE DISPLAY TECH LTD (GB)
HALLS JONATHAN (GB)
WILSON RICHARD (GB)
HALLS JONATHAN (GB)
WILSON RICHARD (GB)
International Classes:
H01L51/52; H01L25/04; H01L51/00; H01L51/56; H01L51/42
Domestic Patent References:
| WO2004057674A2 | 2004-07-08 |
Foreign References:
| US20040119403A1 | 2004-06-24 | |||
| FR2831714A1 | 2003-05-02 | |||
| US3713893A | 1973-01-30 |
Download PDF:
Previous Patent: APPARATUS AND METHOD FOR CAPTURING AND TRANSMITTING IMAGES OF A SCENE
Next Patent: REMOTE SMARTCARD APPLICATION MANAGEMENT
Next Patent: REMOTE SMARTCARD APPLICATION MANAGEMENT