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Patent Searching and Data


Title:
LAMINATED RESIN SHEET, EMBOSSED SHEET AND COVERED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2003/045690
Kind Code:
A1
Abstract:
A bilayer resin sheet comprising an embossable layer (A layer) which consists of a resin composition having substantially no crystallinity or a low crystallinity or contains a resin composition having substantially no crystallinity or a low crystallinity in a major amount and a substrate layer (B layer) which consists of a resin composition being substantially crystalline or contains a resin composition being substantially crystalline in a major amount, wherein the A layer makes the resin sheet embossable. The bilayer resin sheet can be embossed by means of an embossing apparatus for PVC currently used, without causing problems such as cutting of a sheet by melting and sticking or winding up to a heating roll.

Inventors:
TAKAKI YASUHIRO
EBITANI TOSHIAKI
SAKAMOTO HIROSHI
WAKAYAMA YOSHIO
Application Number:
PCT/JP2002/011633
Publication Date:
June 05, 2003
Filing Date:
November 07, 2002
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC (JP)
International Classes:
B29C59/04; B32B27/32; (IPC1-7): B32B27/08; B32B27/00; B32B27/36
Foreign References:
JPH11979A1999-01-06
JP2001270055A2001-10-02
JP2001322219A2001-11-20
Attorney, Agent or Firm:
Kamada, Bunji (Nipponbashi 1-chome Chuo-k, Osaka-shi Osaka, JP)
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