Title:
LAMINATION METHOD FOR FLEXIBLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/000810
Kind Code:
A1
Abstract:
Provided by the present invention is a lamination method for a flexible circuit board. The flexible circuit board comprises an inner flexible circuit board and N layers of outer flexible circuit boards sequentially stacked on the inner flexible circuit board, where N is a positive integer. The lamination method comprises the following steps: setting an identification point; constructing a workbench; the flexible circuit board adds an electric charge; the inner flexible circuit board is aligned with the workbench; and the outer flexible circuit boards are aligned with the inner flexible circuit board. Compared to the prior art, the lamination method for the flexible circuit board according to the present invention uses an image control system for positioning, and the inner flexible circuit board and the outer flexible circuit boards are fixed by means of electrostatic adsorption, so that the alignment precision is greatly improved.
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Inventors:
CHEN KANG (CN)
HAN JIAMING (CN)
CHEN YONGLI (CN)
HAN JIAMING (CN)
CHEN YONGLI (CN)
Application Number:
PCT/CN2020/116280
Publication Date:
January 06, 2022
Filing Date:
September 18, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECH SHUYANG CO LTD (CN)
AAC MODULE ELECTRONIC SHUYANG CO LTD (CN)
AAC TECH SHUYANG CO LTD (CN)
AAC MODULE ELECTRONIC SHUYANG CO LTD (CN)
International Classes:
H05K3/46
Foreign References:
| CN101203095A | 2008-06-18 | |||
| CN110072350A | 2019-07-30 | |||
| KR20160062271A | 2016-06-02 | |||
| CN110012621A | 2019-07-12 | |||
| CN109348624A | 2019-02-15 | |||
| CN106211637A | 2016-12-07 | |||
| US20150296610A1 | 2015-10-15 |
Attorney, Agent or Firm:
SHENZHEN JUNXINCHENG INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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