Title:
LAMINATION SHAPING DEVICE, LAMINATION SHAPING METHOD, AND LAMINATION SHAPING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/024431
Kind Code:
A1
Abstract:
A lamination shaping device (100) that repeats additive working of fusion of a working material (7) and addition of solidified working material (7) upon a working object (3) to form a structured article (4) comprises a height measurement unit that measures the height of a formed structured article (4) at a working position, and a control unit (51) that controls a working condition for adding working material (7) to the working position on the basis of the measurement results of the height measurement unit.
Inventors:
TAKUSHIMA SHIGERU (JP)
MORITA DAIJI (JP)
SUMI NOBUYUKI (JP)
HATTORI SATOSHI (JP)
FUJII TAKAFUMI (JP)
KAYASHIMA SHUN (JP)
MORITA DAIJI (JP)
SUMI NOBUYUKI (JP)
HATTORI SATOSHI (JP)
FUJII TAKAFUMI (JP)
KAYASHIMA SHUN (JP)
Application Number:
PCT/JP2019/031218
Publication Date:
February 11, 2021
Filing Date:
August 07, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B22F3/105; B23K26/34; B22F3/16; B23K26/21; B33Y10/00; B33Y30/00; B33Y50/02
Foreign References:
| JP2018149570A | 2018-09-27 | |||
| JP4556160B2 | 2010-10-06 | |||
| JP6472585B1 | 2019-02-20 | |||
| JP2019112677A | 2019-07-11 | |||
| JP2012242134A | 2012-12-10 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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