Title:
LAPPING DEVICE AND LAPPING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/080293
Kind Code:
A1
Abstract:
A lapping device comprises a lapping machine (13) supported pivotally by a rotation shaft (12), a slurry supply device (15) for supplying abrasive gain slurry (14) to a surface of the lapping machine (13), and a tool (17) for holding an object to be polished. The tool (17) rotatably holds an object (16) to be polished while keeping the object in contact with the surface of the lapping machine (13) through the abrasive grain slurry (14). Ultrasonic vibration apply means (41a, 41b) for applying ultrasonic vibration perpendicular to the surface of the lapping machine (13) are additionally installed to at least one of the lapping machine (13), the rotation shaft (12) of the lapping machine (13) and the tool (17) for holding an object to be polished The ultrasonic vibration apply means (41a, 41b) are provided with means (47) for supplying electric energy. The lapping device is capable of conducting polishing with accuracy higher than that of conventional lapping devices even when the same abrasive grain slurry (14) is used.
Inventors:
OHNISHI KAZUMASA (JP)
Application Number:
PCT/JP2003/003637
Publication Date:
October 02, 2003
Filing Date:
March 25, 2003
Export Citation:
Assignee:
OHNISHI KAZUMASA (JP)
International Classes:
B24B1/04; B24B37/04; (IPC1-7): B24B37/00; B24B1/04
Foreign References:
| JPH088216A | 1996-01-12 | |||
| JPH10156706A | 1998-06-16 | |||
| JPH05200659A | 1993-08-10 | |||
| JPH1044000A | 1998-02-17 |
Attorney, Agent or Firm:
Yanagawa, Yasuo (2-14 Yotsuy, Shinjuku-ku Tokyo, JP)
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