LASER APPARATUS AND LASER PROCESSING MACHINE

WIPO Patent Application WO/2023/144995

A1

A laser apparatus (1A) comprises: a first laser element (LD1) of which light emitting points arrayed in a y-axis direction form a first beam group (B1); a second laser element (LD2) of which light emitting points arrayed in the y-axis direction form a second beam group (B2); an output mirror (14) that constitutes the end of an external resonator, and that reflects a part of the first and second beam groups while transmitting the rest; a convergence optical system (11) on which the first and second beam groups are incident in a non-parallel manner, and which, on the rear-stage side thereof, causes the first beam group to be superimposed so as to converge, and causes the second beam group to be superimposed so as to converge; a diffraction grating (12) that is disposed at an intersection point (120) where the first and second beam groups are at least partly superimposed, and that has a diffractive effect in the plane of a plane (50) perpendicular to a third direction perpendicular to the first and second directions; and a collimating optical system (13) which is disposed between the diffraction grating and the output mirror and that collimates the first and second beam groups so that the first and second beam groups are incident on the output mirror vertically in a spatially separated state.

KAWASAKI MASATO (JP)
KIKUCHI HIROSHI (JP)
KATSURA TOMOTAKA (JP)

PCT/JP2022/003301

August 03, 2023

January 28, 2022

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MITSUBISHI ELECTRIC CORP (JP)

H01S5/14; B23K26/064; H01S5/02253; H01S5/02255; H01S5/40

WO2016059893A1	2016-04-21
WO2021229655A1	2021-11-18
WO2017122611A1	2017-07-20
WO2014087726A1	2014-06-12

JP2011205061A	2011-10-13
JP2013521666A	2013-06-10

TAKAMURA, Jun (JP)

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