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Patent Searching and Data


Title:
LASER APPARATUS AND LASER PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/203711
Kind Code:
A1
Abstract:
A laser apparatus (100) is provided with: a pulsed light source (1) that generates signal light (11); an excitation light source (2) that generates excitation light (12); and a plurality of laser media (4a, 4b) that are arranged in series in the optical path of the signal light (11) and are each excited by the excitation light (12) to amplify the signal light (11). The optical axis-direction length of the laser medium (4b) among the plurality of laser media (4a, 4b) that the signal light (11) from the pulsed light source (1) enters last is shorter than the optical axis-direction length of the laser medium (4a) among the plurality of laser media (4a, 4b) that the signal light (11) from the pulsed light source (1) enters first.

Inventors:
HIRAYAMA NOZOMI (JP)
FUJII SHUNSUKE (JP)
KATSURA TOMOTAKA (JP)
FUKAHORI HIDENORI (JP)
Application Number:
PCT/JP2022/018386
Publication Date:
October 26, 2023
Filing Date:
April 21, 2022
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S3/10; B23K26/064; H01S3/00
Domestic Patent References:
WO2021181511A12021-09-16
WO2018203483A12018-11-08
Foreign References:
JP2016082122A2016-05-16
JP2016051897A2016-04-11
JP2001007427A2001-01-12
US20140301417A12014-10-09
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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