Title:
LASER CUTTING DEVICE, LASER CUTTING SYSTEM AND LASER CUTTING METHOD FOR BRITTLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2007/037118
Kind Code:
A1
Abstract:
A laser cutting device for a brittle material capable of realizing the high quality
and high speed cutting of a substrate formed of the brittle material to be cut irrespective
of the size of the substrate to be cut. In the laser cutting device (1), the substrate
(60) is positioned on the holding table (11) of a substrate holding mechanism
(10) while its lower end part is supported by rollers (16). The holding table (11)
is kept in a titled state by a predetermined angle (θ) relative to a vertical
direction (P) so that the substrate (60) can be held on the holding table (11) in
such a state that a planned cutting line (71) for the substrate (60) is tilted by
the predetermined angle (θ) relative to the vertical direction (P). The
substrate (60) is held in a floated state by pressure air (G) jetted from the pressure
air holes (12) of the holding table (11). When a laser radiation unit (20) and a
cooling unit (30) are moved, by a moving unit (40), from the upper side to the lower
side of the substrate (60) along the planned cutting line (71) for the substrate
(60) relative to the substrate (60) positioned by the substrate holding mechanism
(10), a crack (61) advances from the upper side to the lower side of the substrate
(60) along the planned cutting line (71).
Inventors:
KOYAMA HIROTAKA (JP)
HAYASHI MASAKAZU (JP)
HAYASHI MASAKAZU (JP)
Application Number:
PCT/JP2006/318039
Publication Date:
April 05, 2007
Filing Date:
September 12, 2006
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
KOYAMA HIROTAKA (JP)
HAYASHI MASAKAZU (JP)
KOYAMA HIROTAKA (JP)
HAYASHI MASAKAZU (JP)
International Classes:
B23K26/10; B23K26/38; B23K26/40; B28D5/00; C03B33/09
Foreign References:
| JP2004182530A | 2004-07-02 | |||
| JP2005527457A | 2005-09-15 | |||
| JPH11511385A | 1999-10-05 | |||
| JP2003034545A | 2003-02-07 | |||
| JP2003025323A | 2003-01-29 | |||
| JP2004130342A | 2004-04-30 | |||
| JP2005001264A | 2005-01-06 |
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)
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