Title:
LASER CUTTING METHOD AND LASER CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/122099
Kind Code:
A1
Abstract:
This laser cutting method and this laser cutting device address the problem of reliably removing an unneeded portion generated during laser cutting. In the present invention, the problem is solved by: further setting second cutting lines (paths c and h) for irradiation with a laser beam in regions on the side removed as the unneeded portion (scrap (120)) along parts (paths b and f) of first cutting lines (paths a, d, b, e, f, g, and i) for cutting out the product profile (101) from a sheet-shaped member; and beaming laser light along the first cutting lines and the second cutting lines.
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Inventors:
AKAGI MASANORI
KITAGAWA SHINICHIRO
KITAGAWA SHINICHIRO
Application Number:
PCT/JP2013/053383
Publication Date:
August 22, 2013
Filing Date:
February 13, 2013
Export Citation:
Assignee:
NISSAN MOTOR (JP)
AUTOMOTIVE ENERGY SUPPLY CORP (JP)
AUTOMOTIVE ENERGY SUPPLY CORP (JP)
International Classes:
B23K26/38; B23K26/00; B23K26/04
Foreign References:
| JPH09128746A | 1997-05-16 | |||
| JPH11144970A | 1999-05-28 | |||
| JP2010034009A | 2010-02-12 | |||
| JP2011096620A | 2011-05-12 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
Hatta international patent business corporation (JP)
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Claims: