Title:
LASER DIODE PACKAGING MODULE, DISTANCE MEASUREMENT APPARATUS, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/107164
Kind Code:
A1
Abstract:
A laser diode packaging module, a distance measurement apparatus (100), and an electronic device. The packing module comprises: a sealing member (304); a laser diode chip (303) embedded in the sealing member (304); a shaping element (302) disposed on an outer surface of the sealing member (304) used to shape emergent lights transmitted from the laser diode chip (303). In the packaging solution, the structures of the shaping element (302) and the sealing member (304) can realize light beam collimation and/or shaping in a convenient and compact manner, reducing the requirements for material processing and assembly process, satisfying the requirement for applications in low-cost scenarios, and the packaging solution has a simple structure and is suitable for mass production.
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Inventors:
LIU XIANG (CN)
HONG XIAOPING (CN)
DONG SHUAI (CN)
HONG XIAOPING (CN)
DONG SHUAI (CN)
Application Number:
PCT/CN2018/117471
Publication Date:
June 04, 2020
Filing Date:
November 26, 2018
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H01S5/0239
Foreign References:
CN104362510A | 2015-02-18 | |||
CN104362510A | 2015-02-18 | |||
US20080056316A1 | 2008-03-06 | |||
CN205982639U | 2017-02-22 | |||
CN101630668A | 2010-01-20 | |||
JP2004319555A | 2004-11-11 |
Attorney, Agent or Firm:
P. C. & ASSOCIATES (CN)
Download PDF:
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