Title:
LASER HEATING DEVICE AND LASER HEATING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/093264
Kind Code:
A1
Abstract:
A laser heating device and a laser heating method enabling soldering that does not burn the periphery and resin bonding that does not burn resin by detecting a temperature change when solder or resin at a processing point is melted and an abnormal heating that may indicate a possible burn occurrence. An IR sensor (9) generates a signal based on the integrated value of the spectral radiation luminance of an IR ray radiated from solder to be heated. Prior to an actual soldering, a relational expression between the calibration values of an output signal from the IR sensor (9) and an actual master solder measuring temperature is determined in advance. At an actual soldering, an IR ray radiated from solder (3) is received by the IR sensor (9) and the temperature of the solder (3) is calculated based on an output signal from the IR sensor (9) and the above relational expression.
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Inventors:
SAKURAI TUTOMU
FUNAMI KOJI
FUNAMI KOJI
Application Number:
PCT/JP2006/304074
Publication Date:
September 08, 2006
Filing Date:
March 03, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
SAKURAI TUTOMU
FUNAMI KOJI
SAKURAI TUTOMU
FUNAMI KOJI
International Classes:
G01J5/08; B23K26/00; B23K26/03; B23K26/073; G01J1/02; G01J5/00; G01J5/28; H01S5/00; B23K101/42
Domestic Patent References:
| WO2003064140A2 | 2003-08-07 |
Foreign References:
| JPH0839273A | 1996-02-13 | |||
| JP2003103382A | 2003-04-08 |
Attorney, Agent or Firm:
Morimoto, Yoshihiro (4th Floor 10-10, Nishi-Hommachi 1-chome,
Nishi-ku, Osaka-sh, Osaka 05, JP)
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