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Title:
LASER IRRADIATION DEVICE, LASER IRRADIATION METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/055840
Kind Code:
A1
Abstract:
According to one embodiment of the present invention, a laser irradiation device (1) is provided with: a laser light generating device (14) for generating laser light; a floating unit (10) for floating a subject (16) to be treated, said subject being to be irradiated with the laser light; and a transfer unit (11) for transferring the floating subject 16. The transfer unit (11) transfers the subject (16) by retaining a position where the transfer unit (11) is not superimposed with an irradiation position (15) of the laser light. With the laser irradiation device (1) according to the one embodiment of the present invention, occurrence of uneven laser light irradiation can be suppressed.

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Inventors:
MIKAMI TAKAHIRO (JP)
FUJI TAKAHIRO (JP)
SUZUKI YUKI (JP)
YAMAGUCHI YOSHIHIRO (JP)
Application Number:
PCT/JP2017/020641
Publication Date:
March 29, 2018
Filing Date:
June 02, 2017
Export Citation:
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Assignee:
JAPAN STEEL WORKS LTD (JP)
International Classes:
H01L21/268; B65G49/06; H01L21/20; H01L21/677
Domestic Patent References:
WO2013069056A12013-05-16
Foreign References:
JP2004179653A2004-06-24
JP2009010161A2009-01-15
JP2012503311A2012-02-02
JP2006505953A2006-02-16
JP2012182273A2012-09-20
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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