Title:
LASER LAMINATION MOLDING METHOD AND LASER LAMINATION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286658
Kind Code:
A1
Abstract:
In this laser lamination molding method and this laser lamination molding device: the irradiation position with laser light with respect to a converging region (r1) of a powder material is controlled so that the irradiation region (r2) of the laser light is located on a further rear side in the supply nozzle movement direction than the converging region (r1) of the powder material or the center position of the irradiation region (r2) coincides with the center position of the converging region (r1) of the powder material; and the position of a supply nozzle is controlled so that, on a lamination plan surface, an offset amount, by which the converging region (r1) of the powder material is offset below a target converging region due to the influence of gravitational force, is estimated and the offset amount is corrected.
Inventors:
KONDO MASAKI (JP)
Application Number:
PCT/JP2022/026706
Publication Date:
January 19, 2023
Filing Date:
July 05, 2022
Export Citation:
Assignee:
DMG MORI CO LTD (JP)
International Classes:
B23K26/34; B23K26/04; B23K26/082; B23K26/21; B29C64/141; B29C64/209; B29C64/268; B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02
Domestic Patent References:
| WO2015141030A1 | 2015-09-24 | |||
| WO2020250464A1 | 2020-12-17 |
Foreign References:
| JP2017019018A | 2017-01-26 |
Attorney, Agent or Firm:
MURAKAMI, Satoshi (JP)
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