Title:
LASER MACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/149453
Kind Code:
A1
Abstract:
A laser machining head 20 is configured so as to be capable of emitting first laser light L1 having a small wavelength and second laser light L2 having a large wavelength. The laser machining head 20 moves relative to a first member W1 and a second member W2, along a prescribed movement direction. The first member W1 has a higher reflectance of laser light than the second member W2. The first laser light L1 is emitted to the first member W1. The second laser light L2 is emitted to the second member W2.
Inventors:
SAKURAI MICHIO
NAKAGAWA TATSUYUKI
NAKAGAWA TATSUYUKI
Application Number:
PCT/JP2023/003161
Publication Date:
August 10, 2023
Filing Date:
February 01, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K26/21; B23K26/073; B23K26/323
Domestic Patent References:
| WO2016181695A1 | 2016-11-17 |
Foreign References:
| JP2011092944A | 2011-05-12 | |||
| JP2021028072A | 2021-02-25 | |||
| JP2021533999A | 2021-12-09 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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