Title:
LASER MACHINING DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/080672
Kind Code:
A1
Abstract:
The present invention is designed to improve machining quality by eliminating variations in laser pulse pitch and diameter in the acceleration and deceleration regions of laser machining. This laser machining device is characterized in comprising: a laser pulse generation means for generating a laser pulse sequence of a constant period; a light-directing means capable of receiving the laser pulse sequence output from the laser pulse generation means and selectively directing the laser pulses in the laser pulse sequence in the direction to be used for the machining; an optical system for receiving the laser pulses from the light-directing means and irradiating same on the workpiece; a means for driving the table on which the workpiece is loaded; a specified movement amount-detecting means for periodically detecting a specified amount of table movement; and a control means for performing control so that when the specified movement amount-detecting means detects the specified movement amount, laser pulses in the laser pulse sequence output from the laser pulse generation means are directed in the machining direction.
Inventors:
YAMAGAMI KENTARO (JP)
TAKEGAWA YUSUKE (JP)
NISHIBE TATSUYA (JP)
TATEISHI HIDENORI (JP)
TAKEGAWA YUSUKE (JP)
NISHIBE TATSUYA (JP)
TATEISHI HIDENORI (JP)
Application Number:
PCT/JP2013/072796
Publication Date:
May 30, 2014
Filing Date:
August 27, 2013
Export Citation:
Assignee:
VIA MECHANICS LTD (JP)
International Classes:
B23K26/00; B23K26/06; B23K26/067; H05K3/00
Foreign References:
| JP2012130959A | 2012-07-12 | |||
| JP2007054853A | 2007-03-08 | |||
| JP2000210782A | 2000-08-02 |
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