Title:
LASER MACHINING DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/244649
Kind Code:
A1
Abstract:
A laser machining device (100) is provided with: a machining head (35) that emits a laser beam through an opening (36a); a focusing lens (34) for focusing the laser beam on the surface of a metal plate (W); a carriage (22, 23) for moving the position of the machining head (35); a galvano scanner unit (32) for moving the laser beam emitted from the opening (36a); an assist gas supply device (70) for supplying an assist gas to the machining head (35); and an NC device (50). The NC device (50) controls the carriage (22, 23) and carries out control for advancing the irradiation position of the laser beam to mark a scribe line on the metal plate (W), while controlling the galvano scanner unit (32) such that the center of the laser beam emitted from the opening (36a) moves a preset distance forward from the center of the opening (36a) along the route of advance of the irradiation position of the laser beam.
More Like This:
Inventors:
SUGIYAMA AKIHIKO (JP)
Application Number:
PCT/JP2022/019773
Publication Date:
November 24, 2022
Filing Date:
May 10, 2022
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B23K26/00; B23K26/082; B23K26/142; B25H7/04
Domestic Patent References:
| WO2020246354A1 | 2020-12-10 |
Foreign References:
| JPH11788A | 1999-01-06 | |||
| JP2003305584A | 2003-10-28 | |||
| JP2007039716A | 2007-02-15 | |||
| JPH09222498A | 1997-08-26 | |||
| JPH07308792A | 1995-11-28 | |||
| JPH11788A | 1999-01-06 | |||
| JP2021085254A | 2021-06-03 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
Download PDF: