Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090906
Kind Code:
A1
Abstract:
This laser machining device (laser machining device 1) comprises: a support section (support section 7) that can move along a first direction (X direction), and that supports an object (object 100) along the first direction and a second direction (Y direction) which intersects with the first direction; a first laser machining head (laser machining head 10a) and a second laser machining head (laser machining head 10b) that are disposed so as to oppose each other along the second direction, and that emit laser beams onto the object supported by the support section; a first attachment unit (attachment unit 65) to which the first laser machining head is attached, and that can move along a third direction (Z direction) which intersects with the first direction and the second direction, and that can move along the second direction; and a second attachment unit (attachment unit 66) to which the second laser machining head is attached, and that can move along the second direction and the third direction.
Inventors:
SAKAMOTO TAKESHI (JP)
OKUMA JUNJI (JP)
OKUMA JUNJI (JP)
Application Number:
PCT/JP2019/042613
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/08; B23K26/042
Foreign References:
| JPH07214359A | 1995-08-15 | |||
| JP2008066751A | 2008-03-21 | |||
| JP2013536080A | 2013-09-19 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Next Patent: LASER MACHINING DEVICE
Next Patent: LASER MACHINING DEVICE