Title:
LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/200953
Kind Code:
A1
Abstract:
Provided is a laser machining method with which strain occurring in a workpiece can be reduced even when a large number of through-holes are formed. The laser machining method includes: a gas supply step (S3) for making a gas pressure on the back-surface side of a workpiece 1 greater than a gas pressure on the front-surface side thereof; a deep hole step (S5) for irradiating the workpiece 1 from the front-surface side with a pulsed laser having a first repetition frequency f1, thereby forming a through-hole A in the workpiece 1; and a finishing step (S7) for irradiating the inner surface of the through-hole A with a pulsed laser having a second repetition frequency f2 that is less than the first repetition frequency f1.
Inventors:
KOBAYASHI TAKASHI (JP)
OKUBO NARUHIKO (JP)
FUKAMI KENICHI (JP)
KOUKETSU SEIICHI (JP)
OKUBO NARUHIKO (JP)
FUKAMI KENICHI (JP)
KOUKETSU SEIICHI (JP)
Application Number:
PCT/JP2021/013552
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B23K26/382
Foreign References:
| JP2010188361A | 2010-09-02 | |||
| JP2000225486A | 2000-08-15 | |||
| JP2005177786A | 2005-07-07 | |||
| JP2002035973A | 2002-02-05 | |||
| JP2008055477A | 2008-03-13 | |||
| JP2013144312A | 2013-07-25 |
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
Download PDF: