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Patent Searching and Data


Title:
LASER MACHINING PROCESS USING A SCANNER OPTICAL SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/056615
Kind Code:
A3
Abstract:
The invention relates to a laser machining head comprising a scanner unit which is arranged in the beam path of the laser machining head and which has a scanner mirror that is tiltably mounted about two rotational axes. The scanner unit is arranged in the laser machining head such that a laser beam which runs through the beam path is incident on the scanner mirror at an angle of incidence of maximally 30°, preferably maximally 22.5°, more preferably maximally 15°, relative to a surface normal of the scanner mirror. The invention additionally relates to a scanner unit for such a laser machining head, to a laser machining system comprising the laser machining head, and to a laser cutting method.

Inventors:
PAUL AXEL (DE)
RENZ BERND (DE)
HAMMANN GERHARD (DE)
LEINBERGER STEFAN (DE)
HUBER ALEXANDER (DE)
Application Number:
PCT/EP2023/074923
Publication Date:
May 23, 2024
Filing Date:
September 11, 2023
Export Citation:
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Assignee:
TRUMPF WERKZEUGMASCHINEN SE CO KG (DE)
International Classes:
B23K26/06; B23K26/082; B23K26/14; B23K26/38; G02B7/182; G02B26/10
Domestic Patent References:
WO2020109209A12020-06-04
Foreign References:
US20060044655A12006-03-02
JPH075385A1995-01-10
DE102012012780A12014-01-02
DE10027148A12001-12-06
EP1235090A12002-08-28
Attorney, Agent or Firm:
TRUMPF PATENTABTEILUNG (DE)
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