Title:
LASER MICRODISSECTION DEVICE, LASER MICRODISSECTION METHOD, AND QUANTITATIVE ANALYSIS SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/186577
Kind Code:
A1
Abstract:
A laser microdissection device (2) has a data correction unit (20) that corrects data obtained by performing quantitative analysis on sample pieces (911) obtained by a laser microdissection method from a plurality of measurement regions in a sample (91) to be measured. The data correction unit (20) is provided with: an area acquisition unit (22) that, for each of the sample pieces (911), obtains an area value of said sample piece (911); and a correction calculation unit (23) that performs calculation to correct data for each of the sample pieces (911) with the area value of said sample piece (911).
Inventors:
HONG YOUNGSOON (JP)
SAWADA MAKOTO (JP)
ONO KENJI (JP)
SUZUKI HIROMI (JP)
SAWADA MAKOTO (JP)
ONO KENJI (JP)
SUZUKI HIROMI (JP)
Application Number:
PCT/JP2020/011793
Publication Date:
September 23, 2021
Filing Date:
March 17, 2020
Export Citation:
Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
International Classes:
G01N27/62; G01N30/72; G01N30/88
Domestic Patent References:
| WO2018037491A1 | 2018-03-01 | |||
| WO2015053039A1 | 2015-04-16 | |||
| WO2016163385A1 | 2016-10-13 |
Foreign References:
| JP2013245998A | 2013-12-09 | |||
| US20160126073A1 | 2016-05-05 |
Attorney, Agent or Firm:
KYOTO INTERNATIONAL PATENT LAW OFFICE (JP)
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