Title:
LASER MICROMACHINING OF MEMS RESONATORS FROM BULK OPTICALLY TRANSPARENT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/133506
Kind Code:
A3
Abstract:
Systems, processes and devices are provided for laser-based manufacturing of resonators and MEMS devices from bulk material including optically transparent material. Processes include digital marking of resonator structures in bulk material through non-linear interaction of ultrafast laser beam inscribing and material. The resonator structure may be defined and released through selective wet etching of the laser-modified areas, utilizing a combination of basic and acidic aqueous solutions. Processes can also include hydrofluoric thinning prior to wet etching to prevent laser surface damages. Systems and processes can pattern and fabricate resonator structures and concentricring structures. Embodiments provide miniaturized vibratory sensors from low loss material, such as fused silica and quartz, with an improved resolution and accuracy of measurements for inertial sensing, time referencing, bio-sensing and acoustic sensing.
Inventors:
VATANPARVAR DARYOSH (US)
SHKEL ANDREI M (US)
WANG DANMENG (US)
SHKEL ANDREI M (US)
WANG DANMENG (US)
Application Number:
PCT/US2023/060231
Publication Date:
September 28, 2023
Filing Date:
January 06, 2023
Export Citation:
Assignee:
UNIV CALIFORNIA (US)
International Classes:
B81C1/00; G02B6/13; H03H9/17; G01N29/02
Domestic Patent References:
| WO2010148398A2 | 2010-12-23 |
Foreign References:
| US20140239552A1 | 2014-08-28 | |||
| US20190299329A1 | 2019-10-03 | |||
| US20130148681A1 | 2013-06-13 |
Attorney, Agent or Firm:
TERESINSKI, John (US)
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