Title:
LASER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/220706
Kind Code:
A1
Abstract:
A laser processing apparatus for forming a modified region in an object in which a plurality of lines extending along the first direction and arranged along the second direction intersecting the first direction is set by irradiating the object with a laser beam, the laser processing apparatus comprising: a support portion for supporting the object; a first laser processing head and a second laser processing head that irradiate the object supported by the support portion with the laser beam; a first moving mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively; and a control unit for controlling at least the emission of the laser beam from the first laser processing head and the second laser processing head and the movement of the first laser processing head and the second laser processing head by the first moving mechanism.
Inventors:
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/013839
Publication Date:
November 04, 2021
Filing Date:
March 31, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; B23K26/00
Foreign References:
| JP2004111946A | 2004-04-08 | |||
| JPH08238582A | 1996-09-17 | |||
| CN106862777A | 2017-06-20 | |||
| JPH0760469A | 1995-03-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: WORK MACHINE
Next Patent: BINDER COMPOSITION FOR POWER STORAGE DEVICE, SLURRY FOR POWER STORAGE DEVICE ELECTRODE, POWER STORAG...
Next Patent: BINDER COMPOSITION FOR POWER STORAGE DEVICE, SLURRY FOR POWER STORAGE DEVICE ELECTRODE, POWER STORAG...