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Patent Searching and Data


Title:
LASER PROCESSING DEVICE AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2002/066197
Kind Code:
A1
Abstract:
A laser processing device of simple construction that is designed to easily emit laser beam of predetermined energy density to a processing subject area in a predetermined range to effect proper laser processing, making it possible to reduce the size of the device, simplify its maintenance and improve its durability. The laser processing device comprises a semiconductor stack (1) consisting of a plurality of semiconductor laser elements, and a control means for controlling the emission of laser beam from each semiconductor laser element. The semiconductor stack (1) is divided into a plurality of blocks (B11, B12, B13, B14) according to the processing subject area of the work, and the control means controls the emission of laser beam from each block (B11, B12, B13, B14) such that it can be changed with time.

Inventors:
MIKAME KAZUHISA (JP)
Application Number:
PCT/JP2002/001415
Publication Date:
August 29, 2002
Filing Date:
February 19, 2002
Export Citation:
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Assignee:
TOYOTA MOTOR CO LTD (JP)
MIKAME KAZUHISA (JP)
International Classes:
B23K26/32; B23K26/00; B23K26/073; B23K26/21; B23K26/24; B23K26/34; (IPC1-7): B23K26/00
Foreign References:
JPS61199588A1986-09-04
JP2000102886A2000-04-11
JP2002066779A2002-03-05
Attorney, Agent or Firm:
Hanabusa, Tsuneo c/o Hanabusa, Patent Office (Ochanomizu Square B 6 Kandasurugadai 1-chome Chiyoda-ku, Tokyo, JP)
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