LASER PROCESSING DEVICE AND METHOD OF LASER PROCESSING

WIPO Patent Application WO/2010/123068

A1

In order to ensure the quality of an object to be processed after processing, a laser processing device (10) is equipped with: a laser oscillator (18) that oscillates a laser beam (L); a beam splitter (20) that splits the laser beam (L) into a first laser beam (L1) and a second laser beam (L2); a first lens (22) through which the first laser beam (L1) is radiated towards a section of an object to be processed (30) in order to slice the object to be processed (30); and a total reflecting mirror (24), a second lens (26), and a galvano mirror (28) by which the second laser beam (L2) is radiated towards burrs (32, 34) that formed on the object to be processed (30) as the object to be processed (30) was sliced, in order to make the burrs (32, 34) smooth. Even if burrs (32, 34) have formed on the object to be processed (30) as the object to be processed (30) is being sliced, the burrs (32, 34) can be made smooth by the second laser beam (L2), thereby ensuring the quality of the object to be processed (30) after processing.

ARAI TAKEJI (JP)
KAYAHARA TAKASHI (JP)

PCT/JP2010/057155

October 28, 2010

April 22, 2010

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FURUKAWA ELECTRIC CO LTD (JP)
ARAI TAKEJI (JP)
KAYAHARA TAKASHI (JP)

B23K26/067; B23K26/00; B23K26/36; B23K26/38

JPH09314371A	1997-12-09
JP2004306048A	2004-11-04
JP2004130342A	2004-04-30
JPS62137189A	1987-06-20
JPS54153745A	1979-12-04

NAKAJIMA, Jun et al. (JP)
Nakajima 淳 (JP)

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