Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/090894
Kind Code:
A1
Abstract:
This laser processing devices provided with a support unit, an irradiation unit, and a control unit. The irradiation unit has a forming unit which forms a laser beam such that, in a plane perpendicular to the optical axis of the laser beam, the shape of a part of the focus region has a longitudinal direction. The control unit comprises: a determining unit which determines a first orientation and a second orientation such that the longitudinal direction crosses the direction of movement of the part of the focus region; a processing control unit which performs first processing which moves the part of the focus region relatively along a first region to form a modified region and which stops formation of the modified region in the region of a line outside of the first region, and second processing which moves the part of the focus region relatively along a second region to form a modified region and which stops formation of the modified region in the region of the line outside of the second region; and an adjusting unit which, when performing the first processing, adjusts the orientation of the longitudinal direction to be the first orientation and, when performing the second processing, adjusts the orientation of the longitudinal direction to be the second orientation.
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Inventors:
SAKAMOTO TAKESHI (JP)
KOREMATSU KATSUHIRO (JP)
KOREMATSU KATSUHIRO (JP)
Application Number:
PCT/JP2019/042589
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; H01L21/301
Domestic Patent References:
| WO2011030802A1 | 2011-03-17 |
Foreign References:
| JP2018098464A | 2018-06-21 | |||
| JP2006167804A | 2006-06-29 | |||
| JP2017071074A | 2017-04-13 | |||
| JP2015536896A | 2015-12-24 | |||
| JP2017528322A | 2017-09-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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