Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/153317
Kind Code:
A1
Abstract:
A laser processing device according to the present invention focuses a portion of a light-condensing region onto an object, irradiates the object with a laser beam, and thereby forms a modified region along a virtual plane within the object. The laser processing device is provided with: a support unit that supports the object; an irradiation unit that irradiates the object with a laser beam; a movement mechanism that moves the support unit and/or the irradiation unit such that the portion of the light-condensing region moves along the virtual plane within the object; and a control unit that controls the support unit, the irradiation unit, and the movement mechanism. The irradiation unit has a formation unit that forms the laser beam such that the shape of the portion of the light-condensing region within a plane perpendicular to the light axis of the laser beam has a longitudinal direction. The longitudinal direction is a direction that intersects the direction of movement of the portion of the light-condensing region.
Inventors:
KOREMATSU KATSUHIRO (JP)
SAKAMOTO TAKESHI (JP)
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/001509
Publication Date:
August 05, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/08; B23K26/53; H01L21/304
Domestic Patent References:
| WO2020009072A1 | 2020-01-09 | |||
| WO2020213478A1 | 2020-10-22 |
Foreign References:
| JP2020069531A | 2020-05-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: NOODLE-FORM BODY AGGREGATE AND METHOD FOR PRODUCING SAME
Next Patent: ENDOSCOPE TIP FRAME AND ENDOSCOPE
Next Patent: ENDOSCOPE TIP FRAME AND ENDOSCOPE