LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD

WIPO Patent Application WO/2024/057780

A1

This laser processing device comprises a support unit for supporting a target object, a light source for emitting laser light, a spatial optical modulator for modulating the laser light by displaying a modulation pattern, a condensing unit for condensing the laser light onto the target object, a drive unit for driving at least one of the support unit and the condensing unit, and a control unit. The control unit causes the spatial optical modulator to display a modulation pattern that includes a trefoil aberration pattern such that a beam shape of the laser light at a focal spot includes a central portion and a first extended portion, a second extended portion and a third extended portion that extend in a radial pattern from the central portion, and such that the highest intensity in the beam shape central is in the central portion. The control unit causes the drive unit to drive the at least one of the support unit and the condensing unit such that the focal spot moves relatively along a line.

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WO/2015/132640	LASER CLADDING METHOD AND DEVICE FOR IMPLEMENTING SAME

SAKAMOTO TAKESHI (JP)
OGIWARA TAKAFUMI (JP)
OYAIZU MASAKI (JP)

PCT/JP2023/028946

March 21, 2024

August 08, 2023

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HAMAMATSU PHOTONICS KK (JP)

B23K26/064; B23K26/073; B23K26/53; H01L21/301

JP2021090990A	2021-06-17
JP2021087974A	2021-06-10
JP2022029227A	2022-02-17

HASEGAWA Yoshiki et al. (JP)

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