Title:
LASER PROCESSING DEVICE AND PROCESSED ARTICLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/107459
Kind Code:
A1
Abstract:
Provided is a laser processing device that enables a film to be stabilized and processed. The present invention comprises: a conveyance mechanism that conveys a film; a holding mechanism that has a pair of holding parts which can at least sandwich and hold lateral portions of the processing range of the film; and a laser mechanism for processing the processing range of the film held by the holding mechanism.
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Inventors:
KIMURA HIKARU (JP)
ICHIHASHI HIDEO (JP)
MIZUMA KEITA (JP)
HIRANO SHUN (JP)
YACHIGUCHI TAKESHI (JP)
ICHIHASHI HIDEO (JP)
MIZUMA KEITA (JP)
HIRANO SHUN (JP)
YACHIGUCHI TAKESHI (JP)
Application Number:
PCT/JP2021/036109
Publication Date:
May 27, 2022
Filing Date:
September 30, 2021
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B23K26/10; B23K26/382
Domestic Patent References:
| WO2010021025A1 | 2010-02-25 |
Foreign References:
| JPH0890271A | 1996-04-09 | |||
| JPH1158061A | 1999-03-02 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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