LASER PROCESSING DEVICE - MITSUBISHI ELECTRIC CORP

Title:

LASER PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/142239

Kind Code:

A1

Abstract:

A laser processing device (1) has: a nozzle mechanism (3) which guides, to a subject (W) to be processed, laser light outputted from a laser oscillator (11), a first assist gas supplied from a first gas supply source (12), and a second assist gas supplied from a second gas supply source (13); and a control device (5) that controls pressure of the first assist gas and pressure of the second assist gas. The nozzle mechanism (3) has: a first inner nozzle that guides the laser light and the first assist gas to the subject (W); and an outer nozzle, which surrounds the first inner nozzle, and guides the second assist gas to the subject (W). The pressure of the second assist gas is made higher than the pressure of the first assist gas by means of the control device (5).

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Inventors:

MIYAZAKI TAKANORI (JP)

Application Number:

PCT/JP2018/001029

Publication Date:

July 25, 2019

Filing Date:

January 16, 2018

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

B23K26/14; B23K26/38; B23K103/02; B23K103/10

Domestic Patent References:

WO2016147410A1

2016-09-22

Foreign References:

JP2002001570A	2002-01-08
JPH09507657A	1997-08-05
JP2002239770A	2002-08-28
JPH0584589A	1993-04-06

Attorney, Agent or Firm:

TAKAMURA, Jun (JP)

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