LASER PROCESSING DEVICE

Title:

LASER PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/184540

Kind Code:

A1

Abstract:

Provided is a laser processing device with which process conditions and process states can be accurately understood. This laser processing device 1 is provided with: a processing laser light source 20 that generates processing laser light CL having an energy density that is continuous over a predetermined time period; first optical systems 31, 32 that irradiate a surface of a workpiece W to be processed with the processing laser light CL; a pulsed laser light source 50 that generates pulsed laser light PL having an energy density having a peak value higher than the energy density of the processing laser light CL; second light sources 61, 62 that irradiate a processing section P of the workpiece W to be processed with the pulsed laser light PL; and a light detecting unit 80 that detects plasma light generated at the processing section P of the workpiece W to be processed.

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Inventors:

MATSUOKA YUJI (JP)
SAKAMOTO AKIRA (JP)

Application Number:

PCT/JP2020/010186

Publication Date:

September 17, 2020

Filing Date:

March 10, 2020

Export Citation:

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Assignee:

FUJIKURA LTD (JP)

International Classes:

B23K26/00; B23K26/064; G02B6/02; G02B6/036; G02B6/42

Foreign References:

JP2001001170A	2001-01-09
JP2015093284A	2015-05-18
JP2003103387A	2003-04-08
JP2018144085A	2018-09-20
JP2019043452A	2019-03-22

Other References: