Title:
LASER PROCESSING MACHINE, LASER PROCESSING METHOD, BOARD MATERIAL PROCESSING SYSTEM, AND BOARD MATERIAL PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/006606
Kind Code:
A1
Abstract:
Provided are: a laser processing machine capable of easily and efficiently transferring a workpiece by making it possible to lift a workpiece placing section for placing the workpiece; and a laser processing method. This laser processing machine is provided with: a laser head (4), which relatively moves with respect to a board-like workpiece (W) disposed in a processing region (R1), and which processes the workpiece (W); a workpiece placing section (6) capable of traveling with the workpiece (W) placed thereon; and a lift device (2) capable of disposing the workpiece (W) in the processing region by lifting the workpiece placing section (6) on which the workpiece (W) is placed.
Inventors:
OZEKI KOJI (JP)
Application Number:
PCT/JP2016/061877
Publication Date:
January 12, 2017
Filing Date:
April 13, 2016
Export Citation:
Assignee:
MURATA MACHINERY LTD (JP)
International Classes:
B21D43/10; B23K26/10; B23P23/00; B30B13/00
Foreign References:
| JP2011098415A | 2011-05-19 | |||
| JPH11277273A | 1999-10-12 | |||
| JPH0542228U | 1993-06-08 |
Other References:
See also references of EP 3318363A4
Attorney, Agent or Firm:
NISHI, Kazuya et al. (JP)
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