LASER PROCESSING METHOD AND LASER PROCESSING DEVICE

Title:

LASER PROCESSING METHOD AND LASER PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2007/032392

Kind Code:

A1

Abstract:

A laser processing method in which the sectional shape at a focusing point P of a laser beam L is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction parallel to the scheduled cutting line (5). Therefore, the shape of a modified region (7) formed inside a silicon wafer (11), when viewed from a laser beam L incident direction, is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction parallel to the scheduled cutting line (5). When the modified region (7) having such a shape is formed inside an object (1) to be processed, twist hackle can be prevented from appearing on a cut section when the object (1) to be processed is cut with the modified region (7) as a cutting start point, whereby it is possible to improve the flatness of a cut section.

Inventors:

OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)

Application Number:

PCT/JP2006/318163

Publication Date:

March 22, 2007

Filing Date:

September 13, 2006

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HAMAMATSU PHOTONICS KK (JP)
OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)

International Classes:

B23K26/40; B23K26/073; B23K26/364; B28D5/00; B23K101/40

Foreign References:

JP2004179302A	2004-06-24
JP2005116844A	2005-04-28
JP2005235993A	2005-09-02
JP2002324768A	2002-11-08
JPH09150286A	1997-06-10
JP2003266185A	2003-09-24
JP2000263257A	2000-09-26
JPH081363A	1996-01-09
US6211488B1	2001-04-03

Other References: