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Patent Searching and Data


Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/032392
Kind Code:
A1
Abstract:
A laser processing method in which the sectional shape at a focusing point P of a laser beam L is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction parallel to the scheduled cutting line (5). Therefore, the shape of a modified region (7) formed inside a silicon wafer (11), when viewed from a laser beam L incident direction, is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction parallel to the scheduled cutting line (5). When the modified region (7) having such a shape is formed inside an object (1) to be processed, twist hackle can be prevented from appearing on a cut section when the object (1) to be processed is cut with the modified region (7) as a cutting start point, whereby it is possible to improve the flatness of a cut section.

Inventors:
OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)
Application Number:
PCT/JP2006/318163
Publication Date:
March 22, 2007
Filing Date:
September 13, 2006
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)
International Classes:
B23K26/40; B23K26/073; B23K26/364; B28D5/00; B23K101/40
Foreign References:
JP2004179302A2004-06-24
JP2005116844A2005-04-28
JP2005235993A2005-09-02
JP2002324768A2002-11-08
JPH09150286A1997-06-10
JP2003266185A2003-09-24
JP2000263257A2000-09-26
JPH081363A1996-01-09
US6211488B12001-04-03
Other References:
See also references of EP 1944118A4
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg. 10-6 Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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