Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/032392
Kind Code:
A1
Abstract:
A laser processing method in which the sectional shape at a focusing point P of
a laser beam L is such that a maximum length in a direction perpendicular to a scheduled
cutting line (5) is shorter than a maximum length in a direction parallel to the
scheduled cutting line (5). Therefore, the shape of a modified region (7) formed
inside a silicon wafer (11), when viewed from a laser beam L incident direction,
is such that a maximum length in a direction perpendicular to a scheduled cutting
line (5) is shorter than a maximum length in a direction parallel to the scheduled
cutting line (5). When the modified region (7) having such a shape is formed inside
an object (1) to be processed, twist hackle can be prevented from appearing on
a cut section when the object (1) to be processed is cut with the modified region
(7) as a cutting start point, whereby it is possible to improve the flatness of
a cut section.
Inventors:
OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)
Application Number:
PCT/JP2006/318163
Publication Date:
March 22, 2007
Filing Date:
September 13, 2006
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)
OSAJIMA TETSUYA (JP)
SUGIURA RYUJI (JP)
ATSUMI KAZUHIRO (JP)
International Classes:
B23K26/40; B23K26/073; B23K26/364; B28D5/00; B23K101/40
Foreign References:
JP2004179302A | 2004-06-24 | |||
JP2005116844A | 2005-04-28 | |||
JP2005235993A | 2005-09-02 | |||
JP2002324768A | 2002-11-08 | |||
JPH09150286A | 1997-06-10 | |||
JP2003266185A | 2003-09-24 | |||
JP2000263257A | 2000-09-26 | |||
JPH081363A | 1996-01-09 | |||
US6211488B1 | 2001-04-03 |
Other References:
See also references of EP 1944118A4
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg. 10-6 Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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