Title:
LASER PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND INSPECTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/071450
Kind Code:
A1
Abstract:
This inspecting device is provided with: a stage supporting a wafer in which a plurality of modified regions have been formed inside a semiconductor substrate; a light source for outputting light that is transparent with respect to the semiconductor substrate; an objective lens which allows light that has propagated through the semiconductor substrate to pass; a light detecting unit for detecting light that has passed through the objective lens; and an inspecting unit for inspecting whether a distal end of a crack extending from the modified region closest to a top surface of the semiconductor substrate toward the top surface exists in an inspection region between the modified region closest to the top surface and the top surface. The objective lens causes a virtual focal point, symmetrical with the focal point in relation to the top surface, to be positioned within the inspection region. The light detecting unit detects, from a rear surface side of the semiconductor substrate via the top surface thereof, light that propagates through the semiconductor substrate to the rear surface side.
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Inventors:
SAKAMOTO TAKESHI (JP)
SUZUKI YASUTAKA (JP)
SANO IKU (JP)
SUZUKI YASUTAKA (JP)
SANO IKU (JP)
Application Number:
PCT/JP2019/038994
Publication Date:
April 09, 2020
Filing Date:
October 02, 2019
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/301; B23K26/00; B23K26/53; B24B7/00; B24B49/12
Foreign References:
| JP2017064746A | 2017-04-06 | |||
| JP2017133997A | 2017-08-03 | |||
| JP2018098296A | 2018-06-21 | |||
| JP2007132761A | 2007-05-31 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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